Description: A 1.4 mil (36 micron) premium dead soft, zero temper, high tensile copper foil coated with and an aggressive, conductive acrylic pressure sensitive adhesive. Superior adhesion, malleability and adhesive conductivity allow for extremely low resistance and make this an excellent shielding tape.
Applications: Designed to meet a wide variety of EMI/RFI shielding applications in the electronics industry. Also for use in printed circuit manufacture and repair. Foil accepts solder easily and does not oxidize.
